Epoxy Dispensing & Stamping(Die Bond Tools)

Epoxy Dispensing & Stamping(Die Bond Tools) Epoxy Dispensing and Stamping Semiconductor Tools and Accessories
Quantity
Add Quotation


Dispensing tools are commonly used for large dies epoxy pattern. This can range from 1x1mm to 50x50mm dies. We supply all types of nozzle patterns to accommodate todays complex die designs. We’ve fabricated some very complex design for special applications. Generally the design and selection of nozzle will depend much on epoxy viscosity and dispensing pattern.

Please leave your enquiry here, we will reply as soon as possible.
Name*  
Company Name  
Product Interested  
Quantity  
Email*  
Contact No.*  
Attachment  
*only support gif, jpeg, jpg, png, pdf
Messages*  

You have 0 items in you cart. Would you like to checkout now?
0 items
Switch to Mobile Version