Semiconductor Tools and Accessories Supplier Philippines

Die and Ball shearing is a common testing practice after bonding. We supply the most precise shear tools for your application. The carbide material which we use is one of the hardest in the world. This result of using an extremely rigid material is the most accurate shear test result possible. Our part accuracy is up to 5micron face width and the smallest face width is up to 20micron.

We supply all types of rubber tips for all types of dies. Our standard rubber tips uses NBR( Nitrile  Butadine Rubber) & our high temperature variation uses viton.The max working temperature can reach up to 250°C.Rubber collets are great for sensitive surface dies which requires a lot of cushioning during pick up.

Ejector Pins are commonly used for the pick up process ejection. We supply a variety of material to accommodate the sensitivity of the application. We have Tungsten Carbide/High Speed Steel/Red Ultem Plastic/Translucent Ultem Plastic in the order of hardest to softest material.

The Vespel collet is a popular choice for high temperature application. We supply two variation of vespel (SP-1 & SP-21). Standard vespel max working temperature is 288°C – 482°C (Intermittent).

This is suitable for applications which are subjected to high heat and has a sensitive pick up surface.

Dispensing tools are commonly used for large dies epoxy pattern. This can range from 1x1mm to 50x50mm dies. We supply all types of nozzle patterns to accommodate todays complex die designs. We’ve fabricated some very complex design for special applications. Generally the design and selection of nozzle will depend much on epoxy viscosity and dispensing pattern.

EFO (Electrode Flame Off) plays the role of firing the Bonding wire for ball formation. The consistency and conductivity of the electrode has a direct impact on the roundness of formation. This formation has a direct impact on the bonding strength and stability. We use high purity 99.95% platinum for optimum conductivity.